Specifications:
-
Model name: MCW5002-64T™
-
Compatibility: AMD Socket 754, (all speeds), 939
(all speeds)
-
Housing Specifications:The upper deck of the
housing is lowered to increase flow velocity through the Diamond-Pin Matrix©.
This in effect improves the rate of heat transfer to the cooling fluid, and
results in overall improved performance.
- CNC machined aluminum L2.5"xW2.5"xH1.5"
- Type II, class 2 blue anodized anti-corrosion treatment
- Barbed fittings for 1/2" or 7/16" ID tubing
-
Base Plate Specifications:
- 0.500" (12.7mm) thick CNC machined copper base plate
- Submersed face (0.250"/6.35mm) is CNC machined from billet to form Patent Pending Diamond-Pin Matrix©.
Design increases heat dissipation surface, and flow turbulence to enhance heat transfer to cooling fluid.
- Outer face is lapped flat to 3/10 of 1/1000",and near-mirror polished.
-
Cold Plate Specifications:
- 0.500" (12.7mm) thick CNC machined copper base plate.
- Exceptional quality and attention to details:
the cold plate base is lapped to 0.0003" (3/10 of 1/1000"), and polished to near-mirror finish to promote
optimum thermal conductivity. Users are advised that while flatness is strictly respected for providing the most
significant benefit to thermal interface, surface polish is a cosmetic component and may vary slightly from one heatsink to another. Re-lapping or polishing the copper base is never recommended.
-
Assembly Specifications:
- Overall dimensions including retention frame: L3.3" x W2.7" x H2.3" (L83.8
x W68.6 x H58.4 mm) - This fits inside of AMD® socket 754 & 939 retention frame.
- Retention Mechanism: AMD® "K8" class processors (socket 754 & 939).
- Hose Barbs: 1/2" barb to 3/8" NPT Thread
-
Thermoelectric Specifications: (measured power draw at 12 VDC: 18 A)
- Couples: 127
- U max: 15.2 VDC
- I max: 24 A
- ΔT max: >67°C
- Q max: 226.1 W
- Dimensions: 50mm x 50mm x 3.10mm
- R(Ω): .48
-
Power Supply Requirements:
- The TEC module is provided with "bare wires" to facilitate installation with
screw type terminals
- We recommend the "Meanwell S320-12" power supply, rated for 25A at 12 Volts
- While it is possible to connect the MCW5002-64T to the computer power-supply, users should be aware that only high-end power-supplies
can accomodate the Peltier module 18amps current draw (at 12 volts). Accordingly, users should verify that their power supply
features at least a 40 Amps ratings for the +12 volts rail.
Description:
The MCW5002-64T™ is a fully assembled liquid-cooled thermoelectric (Peltier)
solution, specifically designed for AMD® "K8" class (socket 754 and 939)
microprocessors.
This unit is intended for advanced users in extreme microprocessor cooling
applications, such as extreme overclocking. The product requires appropriate
insulation measures to prevent the formation of condensation in sensitive areas
of the motherboard. Whereas Swiftech provides gaskets, and specific installation
instructions for such assembly, utilization of this device is at the sole risk
of the user.
Major Features:
-
226Watts 25A at 12V thermoelectric module
-
1/2" barb fittings, for maximum flow rate
-
Patent pending Diamond-Pin Matrix© copper base plate for optimal heat
transfer, and turbulent flow:
-
"Dropped-deck" housing, as featured in the
MCW5000™ release 2 series water-blocks, to increase cooling fluid velocity
through the Diamond-Pin Matrix© area.
-
Bolts directly onto stock AMD retention frame
-
Fully gasketed assembly for condensation control
Thermoelectric Cooling Benefits:
-
Up to 50°C drop in processor operating temperature
-
Solid state module reliability (50,000 hours MTBF)
-
More versatile than vapor compression systems: can be used with almost any
chassis with our MCB-120 "Radbox" external radiator mounting system
-
More economical and easier to implement than vapor compression systems
|
|
