Specifications:

Size:  1 gram tube
Thermal Conductivity:  4.63 W/m K
Viscosity (Pascal * Second):  400
Specific Gravity:  2.5
Electrically Conductive:  No

Description:

This thermal interface compound was developed by Shin Etsu Chemical Co., Ltd. to meet the current and future requirements of high performance microprocessors. It is used to increase surface contact area for heat transfer by minimizing any air bubbles that exist between the top of the processor and the base of the heat sink.