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Specifications:

Dimensions: 6.5mm x6.5mm x12mm
Compatibility:  All Motherboards.
Material:  C1100 Pure Forged Copper
Weight:  2g (Each)
Quantity:  10 MOSFET Heatsinks
Thermal Interface Material:  3M™ 8815 Thermal Tape

Description:

ENZOTECH MOS-C1 heatsinks were designed to offer exceptional heat dissipation for integrated MOSFET motherboards and video cards. MOS-C1 heatsinks are made using a forged copper process which produces a dense material that is extremely efficient at heat extraction. The MOS-C1 heatsink is far superior to traditional heat sinks and it provides the best thermal conductivity to dissipate heat from the MOSFET in your system.